지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2014.10
- 수록면
- 401 - 404 (4page)
이용수
이 논문의 연구 히스토리 (2)
- 이 논문의 후속연구가 궁금하신가요?
- 연관 학술논문 또는 학술발표를 통해 보다 발전된 연구결과를 확인하실 수 있습니다.
- 이 논문의 연구 히스토리 확인하기
초록· 키워드
오류제보하기
As the need for miniaturizing, weight lightening, high performance of small mobile display product such as Tablet PC are increasing, the need for miniaturizing, weight lightening, high performance and high density for connector which is installed interior of that kinds of device are also increasingly needed now.
To meet this kind of demand, we can suggest planar array connector whose terminal pin can be arranged not in one direction but bidirectional to maximize space occupancy. For connector, its contact reliability should be required to deliver electric signal between other components. In order to analyze contact reliability of planar array connector, we developed contact pressure device to compress fine terminal to figure out prediction of contact pressure through analysis and features of contact pressure by test. After forming analysis for contact pressure prediction, we confirmed that spring back at 1.349° generated compared to conventional design through spring back process, after that analysis on contact pressure prediction are proceeded. For predicted contact pressure, it shows 0.65N.
For contact pressure test, we implemented contact pressure test after designating typical 5 pins among 40ea of terminal pin. For every section, it showed contact pressure of similar tendency with value of 0.5N~0.6N for contact pressure distribution.
To meet this kind of demand, we can suggest planar array connector whose terminal pin can be arranged not in one direction but bidirectional to maximize space occupancy. For connector, its contact reliability should be required to deliver electric signal between other components. In order to analyze contact reliability of planar array connector, we developed contact pressure device to compress fine terminal to figure out prediction of contact pressure through analysis and features of contact pressure by test. After forming analysis for contact pressure prediction, we confirmed that spring back at 1.349° generated compared to conventional design through spring back process, after that analysis on contact pressure prediction are proceeded. For predicted contact pressure, it shows 0.65N.
For contact pressure test, we implemented contact pressure test after designating typical 5 pins among 40ea of terminal pin. For every section, it showed contact pressure of similar tendency with value of 0.5N~0.6N for contact pressure distribution.
목차
Abstract
1. 서론
2. 커넥터 터미널 접압력 측정 장비 제작
3. 커넥터 터미널 CAE 적용 압축거동 예측
4. 커넥터 터미널 접압력 특성 평가 시험
5. 결론
참고문헌
참고문헌 (0)
참고문헌 신청이 논문의 저자 정보
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-ECN-0101-2017-551-000834030