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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2015.1
- 수록면
- 213 - 218 (6page)
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초록· 키워드
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Nitric acid leaching was performed to separate tin and bismuth in spent Pb-free solder. The effects of agitation speed and leaching temperatures on the leaching behaviors of tin and bismuth were investigated to recover tin and bismuth from the spent solder, respectively. The leaching efficiency of bismuth increased rapidly with increasing agitation speeds and temperatures, and the efficiency is found to be 97.8% under the following leaching conditions: nitric acid concentration of 1 k mol m− 3, agitation speed of 400 rpm, 1% pulp density, leaching temperature of 90°C, leaching time of 1 hour. In the case of tin, the leaching efficiency increased and then decreased during leaching tests, and a white precipitate was observed in the reactor. XRD results indicate that tin precipitated as stannic acid (SnO2 H2O). Consequently, bismuth and tin could be separated successfully by nitric acid leaching process.
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참고문헌 (11)
참고문헌 신청
Felton, L. E. / 1993 / The Properties of Tin-Bismuth Alloy Solders / JOM 45:28~32
Ficeriova´, J. / 2005 / Thiosulfate leaching of silver, gold and bismuth from a complex sulfide concentrates / Hydrometallurgy 77:35~39
Kim, S. / 2014 / Separation of tin, silver and copper from waste Pb-free solder using hydrochloric acid leaching with hydrogen peroxide / Materials Transactions 55:1885~1889
Ma, H. / 2009 / A review of mechanical properties of lead-free solders for electronic packaging / Journal of Materials Science 44:1141~1158
Pan, J. / 2005 / Lead-free solder joint reliability – State of the art and perspectives / International Microelectronics and Packaging Society 2:72~83
Ficeriova´, J. / 2005 / Thiosulfate leaching of silver, gold and bismuth from a complex sulfide concentrates / Hydrometallurgy 77:35~39
Kim, S. / 2014 / Separation of tin, silver and copper from waste Pb-free solder using hydrochloric acid leaching with hydrogen peroxide / Materials Transactions 55:1885~1889
Ma, H. / 2009 / A review of mechanical properties of lead-free solders for electronic packaging / Journal of Materials Science 44:1141~1158
Pan, J. / 2005 / Lead-free solder joint reliability – State of the art and perspectives / International Microelectronics and Packaging Society 2:72~83
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